welcome,guest
Home » Products » Machinery & Parts » Hardware Industry Tooling & Services » Machine Tooling
TitleProduct

Diamond thickness reducing grinding wheel for silicon and sapphire wafer

  • Price:

    Negotiable

  • minimum:

  • Total supply:

  • Delivery term:

    The date of payment from buyers deliver within days

  • seat:

    Beijing

  • Validity to:

    Long-term effective

  • Last update:

    2017-08-10 10:45

  • Browse the number:

    153

Send an inquiries

Company Profile

Yangfar Industry Co,Ltd

By certification [File Integrity]

Contact: xydiamond(Mr.)  

Telephone:

Area: Beijing

Address: Beijing

Website: http://xydiamond.sinotoken.com/

New Products
Product details
Model Number: D255-#8651 Brand Name: XINYA Key Specifications/Special Features: Ceramicdiamond grinding wheel are special used for grindingSemiconductors material, such as silicone, sapphireSpecial diamond grinding wheel for semiconductors material have the highest sharpness and the best grinding effectThey are designed for grinding the surface of silicone waferand sapphire wafer.For reducing the thickness of thesiliconwaferand sapphire wafer.
Shipping Information:
  • FOB Port: Shanghai
  • Lead Time: 10 - 15 days
Main Export Markets:
  • Asia
  • Australasia
  • Central/South America
  • Eastern Europe
  • Mid East/Africa
  • North America
  • Western Europe